Remotely microwave enhanced wet anisotropic etching of monocrystalline silicon utilizing a memory effect of microwave activation of KOH

被引：0

作者：

Walczak, R ^{[1
]}

Dziuban, J ^{[1
]}

机构：

[1] Wroclaw Univ Technol, Fac Microsyst Elect & Photon, PL-50372 Wroclaw, Poland

来源：

OPTOELECTRONIC AND ELECTRONIC SENSORS V | 2002年

关键词：

deep silicon micromachining; anisotropy; wet etching; microwave; irradiation; memory; water;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new microwave enhanced anisotropic wet method of etching of silicon (External Etching Microwave Silicon - E2MSi), has been presented. In the method an etchant is irradiated by microwave and then flows to an external reaction chamber where etching is performed. The reaction chamber is situated outside of area of microwave irradiation. The main characteristics of E2Msi etching has been presented. It has been shown that the new process utilizes a memory effect of high chemical reactivity observed in water and water-based solution irradiated by microwave.

引用

页码：96 / 103

页数：8

共 38 条

[1] Microwave enhanced wet anisotropic etching of silicon utilizing a memory effect of KOH activation - a remote E2MSi process
Walczak, R
Dziuban, JA
SENSORS AND ACTUATORS A-PHYSICAL, 2004, 116 (01) : 161 - 170
[2] Fast wet anisotropic etching of silicon utilizing microwave treatment of KOH etchant
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MEASUREMENT SCIENCE AND TECHNOLOGY, 2006, 17 (01) : 38 - 44
[3] Microwave enhanced fast anisotropic etching of monocrystalline silicon
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[4] Effect of magnesium in KOH solution on the anisotropic wet etching of silicon
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[5] Effect of magnesium in KOH solution on anisotropic wet etching of silicon
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[6] Etching microwave silicon [EMSi]-microwave enhanced fast deep anisotropic etching of silicon for micro-electromechanical systems [MEMS]
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[7] The effect of monohydric and polyhydric alcohols on silicon anisotropic etching in KOH solutions
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[8] Silicon flow stop frame for encapsulation of CMOS microsensor chips by wet anisotropic etching in KOH
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ENGINEERING RESEARCH EXPRESS, 2024, 6 (02):
[9] Micromorphology of single crystalline silicon surfaces during anisotropic wet chemical etching in KOH and TMAH
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SENSORS AND ACTUATORS A-PHYSICAL, 2001, 93 (03) : 219 - 231
[10] Investigation of the Dependence of the Silicon Needle Shape on the KOH Solution Concentration during Anisotropic Wet Etching
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SEMICONDUCTORS, 2023, 57 (01) : 52 - 57

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