Microstructure, mechanical properties and thermal conductivity of (Ti0.5Nb0.5)C-SiC composites

被引:9
|
作者
Qian, Yizhou [1 ,2 ]
Wang, Yujin [1 ,2 ]
Chen, Lei [1 ,2 ]
Zhou, Yu [1 ,2 ]
机构
[1] Harbin Inst Technol, Inst Adv Ceram, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
[2] Harbin Inst Technol, Key Lab Adv Struct Funct Integrated Mat & Green M, Harbin 150001, Peoples R China
基金
中国国家自然科学基金;
关键词
Carbides; Mechanical properties; Thermal conductivity; Solid solution; OXIDATION RESISTANCE; CARBIDE; CERAMICS; NANOCOMPOSITES; DENSIFICATION;
D O I
10.1016/j.ceramint.2021.11.225
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A series of (Ti0.5Nb0.5)C-x wt.% SiC (x = 0, 5, 10, 20) composites were prepared by spark plasma sintering. Dense microstructures with well-dispersed SiC particles were obtained for all composites. With the increment of SiC content, the Vickers hardness, Young's modulus and fracture toughness increase monotonically. An optimized flexural strength of 706 MPa was achieved in (Ti0.5Nb0.5)C-5 wt.%SiC composite. (Ti0.5Nb0.5)C-20 wt%SiC composite exhibits the highest fracture toughness of 6.8 MPa m(1/2). The crack deflections and the suppression of grain growth were the main strengthening and toughening mechanisms. Besides, (Ti0.5Nb0.5)C-20 wt%SiC composite exhibit the highest thermal conductivity of 45 W/m.K at 800 degrees C.
引用
收藏
页码:6745 / 6749
页数:5
相关论文
共 50 条
  • [41] Mechanical and tribological properties of C/C-SiC ceramic composites with different preforms
    Peng, Yuqing
    Li, Zhiwei
    Li, Aijun
    Wang, Qifan
    Bai, Ruicheng
    Zhang, Fangzhou
    SCIENCE AND ENGINEERING OF COMPOSITE MATERIALS, 2023, 30 (01)
  • [42] Study of rapid fabrication and microstructure of C/C-SiC composites
    Wang, JP
    Jin, ZH
    Qian, JM
    Qiao, GJ
    RARE METAL MATERIALS AND ENGINEERING, 2006, 35 (02) : 223 - 226
  • [43] Effect of Ce addition on the microstructure, thermal conductivity and mechanical properties of Mg-0.5Mn alloys
    Zhong, Liping
    Peng, Jian
    Li, Min
    Wang, Yongjian
    Lu, Yun
    Pan, Fusheng
    JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 661 : 402 - 410
  • [44] Microstructure and properties of α-FeSi2 modified C/C-SiC brake composites
    Fan, Shangwu
    Du, Yong
    He, Liuyang
    Yang, Chuan
    Liu, Haiping
    Cheng, Laifei
    Zhang, Litong
    Travitzky, Nahum
    TRIBOLOGY INTERNATIONAL, 2016, 102 : 10 - 18
  • [45] Effect of WC content on the microstructure and mechanical properties of Ti(C0.5N0.5)-WC-Mo-Ni cermets
    Qu, Jun
    Xiong, Weihao
    Ye, Dameng
    Yao, Zhenghua
    Liu, Wenjun
    Lin, Shaojiang
    INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, 2010, 28 (02): : 243 - 249
  • [46] Effects of preform structure on microstructure and mechanical properties of long/short fiber-coupled C/C-SiC composites
    Ye, Zhiyong
    Wang, Yalei
    Xiong, Xiang
    Wang, Jinming
    Li, Tongqi
    Liu, Huaifei
    Liu, Zaidong
    Wei, Yanbin
    INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY, 2024, 21 (03) : 1812 - 1828
  • [47] Microstructure and mechanical properties of refractory HfMo0.5NbTiV0.5Six high-entropy composites
    Liu, Yuan
    Zhang, Yan
    Zhang, Heng
    Wang, Naijuan
    Chen, Xiang
    Zhang, Huawei
    Li, Yanxiang
    JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 694 : 869 - 876
  • [48] Effect of high temperature treatment on the fabrication and mechanical properties of C/C-SiC composites
    Wang, LS
    Xiong, X
    Xiao, P
    Yan, ZQ
    Zhang, HB
    Liu, GS
    NEW CARBON MATERIALS, 2005, 20 (03) : 245 - 249
  • [49] Effect of C/C preform density on microstructure and mechanical properties of C/C-SiC composites prepared by alloyed reactive melt infiltration
    Tong, Y. G.
    Bai, S. X.
    Zhang, H.
    Ye, Y. C.
    MATERIALS SCIENCE AND TECHNOLOGY, 2012, 28 (12) : 1505 - 1512
  • [50] Influence of Thermal Fiber Pretreatment on Microstructure and Mechanical Properties of C/C-SiC with Thermoplastic Polymer-Derived Matrices
    Reichert, Florian
    Langhof, Nico
    Krenkel, Walter
    ADVANCED ENGINEERING MATERIALS, 2015, 17 (08) : 1119 - 1126