THE SIGNAL INTEGRITY SIMULATION OF SIP PACKAGE USING TSV INTERPOSER TECHNOLOGY

被引：0

作者：

Sima, Ge ^{[1
]}

Xu, Jian ^{[1
]}

Sun, Peng ^{[1
]}

机构：

[1] Natl Ctr Adv Packaging NCAP China, Wuxi 214135, Jiangsu, Peoples R China

来源：

2018 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC) | 2018年

关键词：

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this pater, we demonstrated the SI(Signal Integrity) Simulation of the SIP package for four chips using the TSV Interposer technology, which is mounted on the silicon interposer using TCB, and the interposer is then mounted on the package with Flip chip. The SI Analysis contained three parts, first is the 3D modeling and optimization analysis of TSV(Through-Silicon-Via) on the board; second is the simulation and comparison of eight different trace topologies, and the better topology has been gotten; third is the analysis of transmission and reflection characteristics by S-parameter extraction in the 0 similar to 7.5GHz bandwidth of the actual signal networks. Right choose of parameters and topologies can make the whole transmission link with better electrical performance.

引用

页数：3

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