Compliant substrate technology: Status and prospects

被引:38
|
作者
Brown, AS [1 ]
机构
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源
关键词
D O I
10.1116/1.590166
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Compliant substrates offer a new approach to strain management in lattice-mismatched structures. The role of the compliant substrate is to reduce the strain in a mismatched overlayer by sharing the strain via deformation of the substrate, or by nucleating and confining defects in the substrate. This can be accomplished by using a thin, "free-standing" substrate. Current efforts are primarily focused on the specification, design, and, fabrication of an "ideal" compliant substrate. Key processing issues include; the etching of the substrate and the bonding, of the substrate to a mechanical handle wafer. Dramatically reduced dislocation densities, as well as reduced relaxation rates, have been observed for the growth of mismatched overlayers on compliant substrates. (C) 1998 American Vacuum Society.
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页码:2308 / 2312
页数:5
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