HIGHLIGHTS OF 2011 iNEMI TECHNOLOGY ROADMAP

被引：0

作者：

Bader, Bill ^{[1
]}

Richardson, Chuck ^{[1
]}

Pfahl, Robert C., Jr. ^{[1
]}

O'Malley, Grace ^{[1
]}

机构：

[1] Int Elect Mfg Initiat iNEMI, Herndon, VA 20170 USA

来源：

EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE | 2011年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

iNEMI released its 2011 Technology Roadmap to industry on March 29, 2011. The Roadmap covers six product segments and 21 technology areas pertinent to electronics manufacturing. Every two years iNEMI maps future manufacturing technology needs of the global electronics industry for the next ten years. It discusses the major business and technology issues, paradigm shifts, emerging technologies and markets, technology gaps, and identified needs in each of six product segments: aerospace/defense, automotive, consumer/portable, medical, Netcom, and office/large business systems. This paper highlights two product sector chapters (Automotive, Medical) and three technology chapters (MEMS, Packaging, and Environmentally Conscious Electronics).

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页数：9

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