NOVEL CROSSTALK MINIMIZATION CODE FOR 3D IC

被引：0

作者：

Zhang, Yifan ^{[1
]}

Li, BinBin ^{[1
]}

Zhang, Balun ^{[1
]}

Xue, Dongmei ^{[1
]}

机构：

[1] Peking Univ, ShenZhen Grad Sch, Shenzhen 518055, Guangdong, Peoples R China

来源：

2015 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE | 2015年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

3D integration with through-silicon-vias(TSVs) is a promising way in circuit design. Due to the large dimensions and the tight space of TSVs, signal transmission and integrity face severe challenge from the capacitive crosstalk of TSVs. This paper proposes a 3*3 TSVs modified Fibonacci based Binary Numeral System (FNS) applied to 3*N mesh to reduce the worst crosstalk delay. Partial encoding which means 9-bit Fibonacci code represent 6-bit binary code is applied to the coding and decoding circuit to make the area overhead lower. The experiment shows that the proposed coding scheme can decrease 31% crosstalk delay time compared with the uncoded situation.

引用

页数：3

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