Microstructure and electrical properties of Ni-Cr thin films fabricated by ion beam sputtering

被引：0
|
作者：
Zhou, J. C. [1 ]
Tian, L. [1 ]
Yan, J. W. [1 ]
机构：
[1] Cent S Univ, Sch Phys Sci & Technol, Changsha 410083, Peoples R China
来源：
MATERIALS SCIENCE AND TECHNOLOGY | 2007年 / 23卷 / 09期
关键词：
Ni-Cr thin films; microstructure; sheet resistance; TCR; GF;
D O I：
10.1179/174328407X161079
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
By ion beam sputtering method, Ni-Cr films were fabricated. Then the films were characterised by X-ray diffraction (XRD), atomic force microscopy (AFM), Alpha-Step IQ profilers, four point probe (FPP) respectively. The thin film electrical properties and its microstructure have been probed into. The gauge factor (GF) of the Ni-Cr thin films was determined by cantilever beam method. The results show that the Ni-Cr thin films can be used as piezoresistive films, which present specific characteristics such as relative small temperature coefficient of resistance (TCR), good GF and high sheet resistance.
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页码：1054 / 1058
页数：5
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