A 1.9-GHz DECT CMOS power amplifier with fully integrated multilayer LTCC passives

被引:44
|
作者
Heo, D [1 ]
Sutono, A [1 ]
Chen, E [1 ]
Suh, Y [1 ]
Laskar, J [1 ]
机构
[1] Georgia Inst Technol, Packaging Res Ctr, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
关键词
D O I
10.1109/7260.928928
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present the first demonstration of a CMOS power amplifier (PA) utilizing fully integrated multilayer low-temperature co-fired ceramic (LTCC) high-Q passives for 1.9-GHz digital European cordless telecommunications (DECT) applications. The inductor and capacitor library were built in a multilayer LTCC board using a compact topology, An inductor Q-factor as high as 100 with a self-resonant frequency (SRF) as high as 8 GHz was demonstrated. Measured results of the CMOS-LTCC PA show good agreement with the simulated results exhibiting 48% power added efficiency, 26-dBm output power and 17-dB gain at 1.9 GHz with a 3,3-V drain supply voltage. This result is the first significant step toward a compact DECT transceiver module development utilizing fully integrated multilayer LTCC passives and a standard CMOS technology.
引用
收藏
页码:249 / 251
页数:3
相关论文
共 50 条
  • [21] A 1.9-GHz single-chip CMOS PHS cellphone
    Si, William W.
    Mehta, Srenik
    Samavati, Hirad
    Terrovitis, Manolis
    Mack, Michael
    Onodera, Keith
    Jen, Steve
    Luschas, Susan
    Hwang, Justin
    Mendis, Suni
    Su, David
    Wooley, Bruce
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2006, 41 (12) : 2737 - 2745
  • [22] A 1.9-GHz CMOS VCO with micromachined electromechanically tunable capacitors
    Dec, A
    Suyama, K
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2000, 35 (08) : 1231 - 1237
  • [23] A Fully Integrated CMOS Power Amplifier with a 133% Relative Bandwidth upon Multilayer Inductors
    Ren, Daming
    Zou, Yiwei
    Zou, Wei
    Zou, Xuecheng
    [J]. 2021 5TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE (EDTM), 2021,
  • [24] A 1.9-GHz triple-mode class-E power amplifier for a polar transmitter
    Park, Changkun
    Kim, Younsuk
    Kim, Haksun
    Hong, Songcheol
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2007, 17 (02) : 148 - 150
  • [25] A 2.4 GHz fully integrated cascode-cascade CMOS doherty power amplifier
    Yang, Li-Yuan
    Chen, Hsin-Shu
    Chen, Yi-Jan Emery
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2008, 18 (03) : 197 - 199
  • [26] Noise and linearity optimization methods for a 1.9-GHz low noise amplifier
    Guo, W
    Huang, DQ
    [J]. 2002 3RD INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY PROCEEDINGS, 2002, : 923 - 927
  • [27] A 2.6-GHz FULLY INTEGRATED CMOS POWER AMPLIFIER USING POWER-COMBINING TRANSFORMER
    Chiou, Hwann-Kaeo
    Liao, Hsien-Yuan
    Chen, Chien-Chung
    Wang, Shih-Ming
    Chen, Cheng-Chung
    [J]. MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2010, 52 (02) : 299 - 302
  • [28] A 500-2500 MHz fully integrated CMOS power amplifier with multilayer series inductors
    Ren, Daming
    Zou, Wei
    Zou, Xuecheng
    [J]. IEICE ELECTRONICS EXPRESS, 2020, 17 (23):
  • [29] A 500-2500 MHz fully integrated CMOS power amplifier with multilayer series inductors
    Ren, Daming
    Zou, Wei
    Zou, Xuecheng
    [J]. IEICE Electronics Express, 2021, 17 (23) : 1 - 5
  • [30] A 12 to 24 GHz high efficiency fully integrated 0.18 μm CMOS power amplifier
    Mosalam, Hamed
    Allam, Ahmed
    Jia, Hongting
    Abdelrahman, Adel
    Kaho, Takana
    Pokharel, Ramesh
    [J]. IEICE ELECTRONICS EXPRESS, 2016, 13 (14):