Dielectric and Thermal Properties of Submicrometric Epoxy/c-BN Composites

被引：0
|
作者：
Heid, Thomas [1 ,2 ]
Frecheffe, Michel [1 ]
David, Eric [2 ]
机构：
[1] Hydro Quebec Res Inst, IREQ, Varennes, PQ J0L 2P0, Canada
[2] Ecole Technol Super, Montreal, PQ, Canada
来源：
2014 IEEE CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA (CEIDP) | 2014年
关键词：
boron nitride; epoxy; dielectric response; polymer composites; thermal conductivity;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this study, the effect of incorporating submicrometric cubic boron nitride (c-BN) in epoxy resin on the respective thermal conductivities and dielectric responses has been investigated. Epoxy composites with c-BN contents of 1 and 5 wt% have been fabricated and compared to neat epoxy. Broadband Dielectric Spectroscopy (BDS) at several temperatures has revealed only minor increases in real and imaginary parts of the complex permittivity for the 5 wt% c-BN composite, while the thermal conductivity has been improved by more than 25 % compared to neat epoxy. Differential Scanning Calorimetry (DSC) has further been conducted on all samples, showing no major change in the glass transition temperatures after incorporation of c-BN in epoxy.
引用
收藏
页码：719 / 722
页数：4
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