Micromachined silicon conformal packaging for millimeter wave system applications

被引：0
|
作者：
Katehi, LPB [1 ]
Kihm, RT [1 ]
机构：
[1] Univ Michigan, Ann Arbor, MI 48109 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 1998年
关键词：
D O I：
10.1109/EPEP.1998.734034
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：247 / 247
页数：1
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