Performance driven multi-layer general area routing for PCB/MCM designs

被引:0
|
作者
Cong, J [1 ]
Madden, PH [1 ]
机构
[1] Univ Calif Los Angeles, Dept Comp Sci, Los Angeles, CA 90095 USA
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper we present a new global router appropriate for Multichip Module (MCM) and dense Printed Circuit Board (PCB) design, which utilizes a hybrid of the classical rip-up and reroute approach, and the more recent iterative deletion[9] method. The global router addresses performance issues by utilizing recent results in high performance interconnect design, while still effectively minimizing global congestion. With experiments on the maze-routing component of our global router, we show that the choice of routing cost functions can have a significant impact on final solution quality. The results of a number of previously proposed routers may be improved dramatically by adopting the cost functions we suggest here. We also find little evidence of the "net ordering problem" when our cost functions and routing model are applied. The iterative deletion method is shown to improve global solution quality, particularly when high performance interconnect is required. We evaluate the performance of our global router by comparing the congestion of routes produced by our global router to those of a well known MCM router, V4R [14]. Our global router, MINOTAUR, supports arbitrary numbers of routing layers, differing capacities for each layer, preexisting congestion and obstacles, and; high performance interconnect structures (including those which require variable width interconnect).
引用
收藏
页码:356 / 361
页数:6
相关论文
共 50 条
  • [1] The effects of signal layer positions in multi-layer PCB designs
    Fan, J
    Knighten, JL
    Smith, NW
    Alexander, R
    Dressler, D
    2002 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2, SYMPOSIUM RECORD, 2002, : 320 - 324
  • [2] Performance driven and shape-based routing algorithm for PCB/MCM design
    2001, Institute of Computing Technology (13):
  • [3] GREA: A global routing algorithm for multi-layer PCB based on evenness analysis
    Qiao, CG
    Hong, XL
    Quan, XZ
    Cai, YC
    FIFTH INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN & COMPUTER GRAPHICS, VOLS 1 AND 2, 1997, : 554 - 557
  • [4] Neural network approach for via minimization in multi-layer VLSI/PCB routing
    Zhejiang Univ, Hangzhou, China
    Tien Tzu Hsueh Pao/Acta Electronica Sinica, 1998, 26 (02): : 20 - 24
  • [5] Layer stackup analysis of multi-layer PCB
    Sun, TL
    Wang, HC
    ICEMI'2003: PROCEEDINGS OF THE SIXTH INTERNATIONAL CONFERENCE ON ELECTRONIC MEASUREMENT & INSTRUMENTS, VOLS 1-3, 2003, : 1318 - 1322
  • [6] Optimizing the Antenna Area and Separators in Layer Assignment of Multi-Layer Global Routing
    Liu, Wen-Hao
    Li, Yih-Lang
    ISPD 12: PROCEEDINGS OF THE 2012 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, 2012, : 137 - 144
  • [7] Via design in multi-layer PCB
    Du, MZ
    Li, SF
    Qiu, XF
    ASIA-PACIFIC CONFERENCE ON ENVIRONMENTAL ELECTROMAGNETICS, CEEM'2003, PROCEEDINGS, 2003, : 94 - 98
  • [8] A multi-layer area routing algorithm with optimized pin mapping strategy
    Yang, L
    Hong, XL
    Cai, YC
    Zhou, Q
    Du, CX
    2003 5TH INTERNATIONAL CONFERENCE ON ASIC, VOLS 1 AND 2, PROCEEDINGS, 2003, : 229 - 232
  • [9] High performance multi-layer routing for VLSI circuit synthesis
    Bhowal, S
    Pal, RK
    TENCON 2004 - 2004 IEEE REGION 10 CONFERENCE, VOLS A-D, PROCEEDINGS: ANALOG AND DIGITAL TECHNIQUES IN ELECTRICAL ENGINEERING, 2004, : D328 - D331
  • [10] Multi-Layer Designs for Computer Experiments
    Ba, Shan
    Joseph, V. Roshan
    JOURNAL OF THE AMERICAN STATISTICAL ASSOCIATION, 2011, 106 (495) : 1139 - 1149