Pulse-echo ultrasonic measurements of compressibility coefficient of thick epoxy resin during the curing process

被引：1

作者：

Maia, Newton Alves ^{[1
]}

Pereira, Fernando Reiszel ^{[2
]}

Cella, Norberto ^{[1
]}

机构：

[1] UERJ, IPRJ, Inst Politecn, POB 97282, BR-28601970 Nova Friburgo, RJ, Brazil

[2] Univ Estado Rio De Janeiro, ESDI, Rua Evaristo da Veiga 95, BR-20031040 Rio De Janeiro, RJ, Brazil

来源：

MATERIALS TODAY COMMUNICATIONS | 2018年 / 17卷

关键词：

Ultrasonic wave; Epoxy resin; Curing-process monitoring; Mechanical properties; NETWORK FORMATION; REAL-TIME; CURE; FREQUENCY; SYSTEM; WAVES; DEPENDENCE; KINETICS; MONITOR; SHEAR;

D O I：

10.1016/j.mtcomm.2018.09.007

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A pulse-echo apparatus was developed to maximize the amplitude of the reflected ultrasonic pulse in monitoring the curing process of epoxy resin. The aim was to increase the ultrasonic wave path in the resin, keeping its amplitude detectable while making it possible to study thick samples. Samples 5.0 x 10(-3) m thick were used in the measurements. During the curing process, the longitudinal wave speed ranged from 1475 to 2300 m/s and the attenuation ranged from 2.5 x 10(3) to 5.5 x 10(3) dB/m. Using a theoretical model for an ultrasonic wave traveling in a viscoelastic medium, and assuming that the density of epoxy resin does not change during the curing process, the compressibility coefficient was obtained as a function of the curing time. The values obtained for the compressibility coefficient ranged from 1.8 x 10(-10) to 4.3 x 10(-10) Pa-1, in good agreement with literature values.

引用

页码：194 / 199

页数：6

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