Progress of Atmospheric Screen-printable Cu Paste for High Efficiency PERC Solar Cells

被引:4
|
作者
Ebong, Abasifreke [1 ]
Huneycutt, Sandra [1 ]
Grempels, Sarah [1 ]
Ankireddy, Krishnamraju [2 ]
Dharmadasa, Ruvini [2 ]
Druffel, Thad [2 ]
机构
[1] Univ North Carolina Charlotte, Dept Elect & Comp Engn, Charlotte, NC 28223 USA
[2] Bert Thin Films LLC, Louisville, KY 40208 USA
关键词
metallization; oxidation; diffusion; thick film;
D O I
10.1109/PVSC43889.2021.9518703
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
The metallization of solar cells remains a dominating factor for the total cost of solar cell manufacturing and must be reduced. A prime candidate to replace the traditional Ag is Cu since it is close in conductivity but about 100 times lower cost. However, the oxidation of Cu in atmosphere and its diffusion into Si have been troublesome factors preventing its implementation. These two challenges were considered to formulate the thick film Cu paste and the 19.4% efficiency, fill factor of 76.02%, short-circuit current density of 39.0 mA/cm(2) and open-circuit voltage of 654.4 mV, show these challenges have been overcome.
引用
收藏
页码:1417 / 1420
页数:4
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