Nondestructive in Chip Multi-Layer Weak Pattern Real Time Detection

被引：0
|
作者：
Hou, Hsin-Ming [1 ]
Kung, Ji Fu [1 ]
Hsu, Y. B. [1 ]
Chen, Selena [1 ]
机构：
[1] United Microelect Corp, 18,20,Nanke 2nd Rd,Tainan Sci Pk, Tainan 74147, Taiwan
来源：
2015 Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM) | 2015年
关键词：
Weak Patterns/Defects Per Million Opportunities (WP-DPMO); Multi-layer; Bias Contour; Big Data; Statistics; Die to DataBase (D2DB); Global Variation(GV) and Local Variation (LV);
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页数：4
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