Effect of polymer orientation on pattern replication in a micro-hot embossing process: experiments and numerical simulation

被引:5
|
作者
Jena, R. K. [1 ,2 ]
Taylor, H. K. [1 ,3 ]
Lam, Y. C. [1 ,2 ]
Boning, D. S. [1 ,3 ]
Yue, C. Y. [1 ,2 ]
机构
[1] Singapore MIT Alliance, Mfg Syst & Technol Programme, Singapore, Singapore
[2] Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore 639798, Singapore
[3] MIT, Microsyst Technol Labs, Cambridge, MA 02139 USA
关键词
MICROFLUIDIC DEVICES; MICROFABRICATION; FABRICATION; DNA; POLY(DIMETHYLSILOXANE); SYSTEMS; POLY(METHYLMETHACRYLATE); CHIPS;
D O I
10.1088/0960-1317/21/6/065007
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The hot embossing process has been identified as a promising technique for fabricating micro-and nanostructures for polymer-based biological and chemical MEMS (micro electro mechanical systems). However, there has not been any investigation of the effect of polymer chain orientation in the base polymer substrate on replication during the micro-embossing process. Such effects could prove important because polymer chain orientation may develop in the polymer substrates during their production. In this investigation, it was observed that the degree and ease of microchannel replication are significantly influenced by the molecular chain orientation in injection-molded polymer substrates. Microchannels aligned along the flow direction of the polymer replicate easily compared to microchannels aligned across the flow direction of the polymer. The replication fidelity during hot embossing was investigated using a white-light confocal microscope. The anisotropy of injection-molded polymer plays a dominant role in the replication fidelity of microchannels, and the ability to model the anisotropic behavior of the material will enable understanding and prediction of the hot embossing process. Therefore, a material model that reflects the directionality was utilized to simulate the experimental embossing results obtained both along and across the flow direction of the polymer. By comparing experimental results with simulations, we observed that the model is reasonably realistic.
引用
收藏
页数:9
相关论文
共 50 条
  • [21] Local mass transport and its effect on global pattern replication during hot embossing
    Schulz, H
    Wissen, M
    Scheer, HC
    MICROELECTRONIC ENGINEERING, 2003, 67-8 : 657 - 663
  • [22] Numerical simulation and experimental study of filling process of micro prism by isothermal hot embossing in solid-like state
    Sun, Jingyao
    Wu, Daming
    Liu, Ying
    Dai, Le
    Jiang, Chong
    ADVANCES IN POLYMER TECHNOLOGY, 2018, 37 (06) : 1581 - 1591
  • [23] Novel multilayered hot embossing process for fabricating a microstructure pattern on various polymer substrates
    Chang, Chih-Yuan
    Tsao, Ren-Hao
    Wang, Chi-Yao
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2020, 30 (11)
  • [24] Experimental and numerical analyses on recovery of polymer deformation after demolding in the hot embossing process
    Takagi, Hideki
    Takahashi, Masaharu
    Maeda, Ryutaro
    Onishi, Yuki
    Iriye, Yasuroh
    Iwasaki, Takuya
    Hirai, Yoshihiko
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2008, 26 (06): : 2399 - 2403
  • [25] Effect of Forming Conditions on Linear Patterning of Polymer Materials by Hot Embossing Process
    Lee, Chang-Su
    Kang, Chung-Gil
    Youn, Sung-Won
    INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2010, 11 (01) : 119 - 127
  • [26] Effect of forming conditions on linear patterning of polymer materials by hot embossing process
    Chang-Su Lee
    Chung-Gil Kang
    Sung-Won Youn
    International Journal of Precision Engineering and Manufacturing, 2010, 11 : 119 - 127
  • [27] Physical modelling and identification of polymer viscoelastic behaviour above glass transition temperature and application to the numerical simulation of the hot embossing process
    Cheng, Gang
    Gelin, Jean-Claude
    Barriere, Thierry
    CURRENT STATE-OF-THE-ART ON MATERIAL FORMING: NUMERICAL AND EXPERIMENTAL APPROACHES AT DIFFERENT LENGTH-SCALES, PTS 1-3, 2013, 554-557 : 1763 - 1776
  • [28] Experimental Analysis and Numerical Simulation of the Flow Behaviour of Thin Polymer Films during Hot Embossing
    Sahli, M.
    Barriere, T.
    Gelin, J-C
    NUMIFORM 2010, VOLS 1 AND 2: DEDICATED TO PROFESSOR O. C. ZIENKIEWICZ (1921-2009), 2010, 1252 : 651 - 658
  • [29] Numerical Simulation of a Thermoviscoelastic Frictional Problem with Application to the Hot-Embossing Process for Manufacturing of Microcomponents
    Kabanemi, K. K.
    Marcotte, J. P.
    Hetu, J. F.
    Worgull, M.
    Heckele, M.
    INTERNATIONAL POLYMER PROCESSING, 2009, 24 (02) : 174 - 184
  • [30] Modeling of the Effect of Heat Flux on Replication Accuracy using Roll-to-roll Micro Hot Embossing
    Chen, S. H.
    Shan, X. C.
    Ng, H. H. S.
    Zhong, Z. W.
    Mohaime, B. M.
    PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 203 - 206