ATE and lock-in thermography coupling techniques for a 3D defect localization in a 4-stacked die memory

Localizing a defect tends to become a challenge with the increase of the die number in the 3D structures. It is more complicated where the failure is a soft defect which required a special activation, especially for memory. In this paper, we propose a new methodology consisting in coupling an Automatic Test Equipment (ATE) system to a failure localization system, and more specifically Lock-in Thermography. The failed die is localized by this technic which enable the possibilities to go further in the failure localization in particular in the destructive physical aperture.