Heterogeneous Integration at Fine Pitch (≤ 10 μm) using Thermal Compression Bonding

The scaling of package and circuit board dimensions is central to heterogeneous system integration. We describe our solderless direct metal-to-metal low pressure (< 70 MPa) and low temperature (< 250 degrees C) thermal compression bonding (TCB) technique and present preliminary results of dielet (4 - 25 mm(2) area) attach to a rigid Silicon Interconnect Fabric (Si-IF) with up to two levels of wiring (2 - 10 mu m pitch). Dielets were attached at a pitch <= 10 mu m with an inter-dielet spacing of <= 100 mu m. We show an effective specific contact resistance of < 1 Omega-mu m(2) and shear strength of > 20 MPa. The combined reduction of dielet interconnect pitch, dielet-to-dielet spacing and trace pitch will enable a Moore's law for packaging.