Capacitive micromachined ultrasonic transducers (CMUTs) with isolation posts

被引:26
|
作者
Huang, Yongli [2 ]
Zhuang, Xuefeng [1 ]
Haeggstrom, Edward O. [3 ]
Ergun, A. Sanli [4 ]
Cheng, Ching-Hsiang [5 ]
Khuri-Yakub, Butrus T. [1 ]
机构
[1] Stanford Univ, Edward L Ginzton Lab, Stanford, CA 94305 USA
[2] Kolo Technol Inc, San Jose, CA USA
[3] Univ Helsinki, Elect Res Unit, Helsinki, Finland
[4] Siemens Corp Res, Mountain View, CA USA
[5] Hong Kong Polytech Univ, Res Inst Innovat Prod & Technol, Hong Kong, Hong Kong, Peoples R China
基金
美国国家科学基金会; 美国国家卫生研究院; 芬兰科学院;
关键词
ultrasound; transducer; CMUT; isolation posts; charging; hysteresis; reliability;
D O I
10.1016/j.ultras.2007.11.006
中图分类号
O42 [声学];
学科分类号
070206 ; 082403 ;
摘要
In this paper, an improved design of a capacitive micromachined ultrasonic transducer (CMUT) is presented. The design improvement aims to address the reliability issues of a CMUT and to extend the device operation beyond the contact (collapse) voltage. The major design novelty is the isolation posts in the vacuum cavities of the CMUT cells instead of full-coverage insulation layers in conventional CMUTs. This eliminates the contact voltage drifting due to charging caused by the insulation layer, and enables repeatable CMUT operation in the post-contact regime. Ultrasonic tests of the CMUTs with isolation posts (PostCMUTs) in air (electrical input impedance and capacitance vs. bias voltage) and immersion (transmission and reception) indicate acoustic performance similar to that obtained from conventional CMUTs while no undesired side effects of this new design is observed. (C) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:74 / 81
页数:8
相关论文
共 50 条
  • [31] CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS FOR ACOUSTIC MANIPULATION
    Mao, S. P.
    Zhong, K.
    Rochus, V.
    Severi, S.
    Nauwelaers, B.
    Tilmans, H. A. C.
    Rottenberg, X.
    2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS), 2015, : 662 - 665
  • [32] Acoustic lens for capacitive micromachined ultrasonic transducers
    Chang, Chienliu
    Firouzi, Kamyar
    Park, Kwan Kyu
    Sarioglu, Ali Fatih
    Nikoozadeh, Amin
    Yoon, Hyo-Seon
    Vaithilingam, Srikant
    Carver, Thomas
    Khuri-Yakub, Butrus T.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2014, 24 (08)
  • [33] An accurate model for capacitive micromachined ultrasonic transducers
    Caronti, A
    Caliano, G
    Iula, A
    Pappalardo, M
    IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 2002, 49 (02) : 159 - 168
  • [34] Experimental characterization of capacitive micromachined ultrasonic transducers
    Olcum, Selim
    Atalar, Abdullah
    Koymen, Hayerttin
    Oguz, Kagan
    Senlik, Muhammed N.
    2007 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1-6, 2007, : 2131 - 2134
  • [35] Capacitive Micromachined Ultrasonic Transducers: Technology and Application
    Salim, Muhammed Sabri
    Malek, M. F. Abd
    Heng, R. B. W.
    Juni, K. M.
    Sabri, Naseer
    JOURNAL OF MEDICAL ULTRASOUND, 2012, 20 (01) : 8 - 31
  • [36] Capacitive micromachined ultrasonic transducers: Theory and technology
    Ergun, AS
    Yaralioglu, GG
    Khuri-Yakub, BT
    JOURNAL OF AEROSPACE ENGINEERING, 2003, 16 (02) : 76 - 84
  • [37] Surface micromachined capacitive ultrasonic immersion transducers
    Jin, XC
    Ladabaum, I
    Khuri-Yakub, BT
    MICRO ELECTRO MECHANICAL SYSTEMS - IEEE ELEVENTH ANNUAL INTERNATIONAL WORKSHOP PROCEEDINGS, 1998, : 649 - 654
  • [38] The characterization of capacitive micromachined ultrasonic transducers in air
    McIntosh, JS
    Hutchins, DA
    Billson, DR
    Robertson, TJ
    Noble, RA
    Jones, ADR
    ULTRASONICS, 2002, 40 (1-8) : 477 - 483
  • [39] Capacitive Micromachined Ultrasonic Transducers for Medical Application
    Li, Yan
    Zhang, Pei-yu
    2015 INTERNATIONAL CONFERENCE ON ELECTRICAL AND ELECTRONICS: TECHNIQUES AND APPLICATIONS (EETA 2015), 2015, : 111 - 116
  • [40] A new class of capacitive micromachined ultrasonic transducers
    Ahrens, O
    Hohlfeld, D
    Buhrdorf, A
    Glitza, O
    Binder, J
    2000 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1 AND 2, 2000, : 939 - 942