Comparison between ZEP and PMMA resists for nanoscale electron beam lithography experimentally and by numerical modeling

被引:44
|
作者
Koshelev, Kirill [1 ,2 ]
Mohammad, Mohammad Ali [1 ]
Fito, Taras [1 ,2 ]
Westra, Kenneth L. [1 ]
Dew, Steven K. [1 ]
Stepanova, Maria [1 ,2 ]
机构
[1] Univ Alberta, Dept Elect & Comp Engn, Edmonton, AB T6G 2V4, Canada
[2] Natl Inst Nanotechnol NRC, Edmonton, AB T6G 2M9, Canada
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2011年 / 29卷 / 06期
基金
加拿大自然科学与工程研究理事会;
关键词
HIGH-RESOLUTION; SIMULATION; FABRICATION; SCATTERING; PROFILE;
D O I
10.1116/1.3640794
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A modern alternative to the positive-tone PMMA resist is the ZEP 520A (Nippon Zeon) brand co-polymer resist, which offers a higher sensitivity and etch durability for electron beam lithography. However, the molecular mechanisms are not entirely understood, and the relative performance of two resists for various process conditions of nanofabrication is not readily predictable. The authors report a thorough experimental comparison of the performance of PMMA 950k and ZEP 520A resists in MIBK:IPA, ZED, and IPA:water developers. Interestingly, ZEP resist performance was found to depend significantly on the developer. ZED developer increases the sensitivity, whereas IPA:water optimizes line edge roughness and conceivably the resolution at the expense of sensitivity. The authors also describe two alternative numerical models, one assuming an enhancement of the main chain scission in ZEP as a result of electronic excitations in side groups, and another without such enhancement. In the second case, the differences in ZEP and PMMA resists performance are attributed to their different interaction with the developers. Using both approaches, the authors parameterize the respective models of ZEP development by fitting numerical results to the experimental resist morphologies, and analyze the outcomes. (C) 2011 American Vacuum Society. [DOI: 10.1116/1.3640794]
引用
收藏
页数:9
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