3D Printed Microstructures Erasable by Darkness

被引:10
|
作者
Gauci, Steven C. [1 ,2 ]
Gernhardt, Marvin [1 ,2 ]
Frisch, Hendrik [1 ,2 ]
Houck, Hannes A. [3 ]
Blinco, James P. [1 ,2 ]
Blasco, Eva [4 ,5 ,6 ]
Tuten, Bryan T. [1 ,2 ]
Barner-Kowollik, Christopher [1 ,2 ,6 ]
机构
[1] Queensland Univ Technol QUT, Sch Chem & Phys, 2 George St, Brisbane, Qld 4000, Australia
[2] Queensland Univ Technol QUT, Ctr Mat Sci, 2 George St, Brisbane, Qld 4000, Australia
[3] Univ Ghent, Ctr Macromol Chem CMaC, Polymer Chem Res Grp, Krijgslaan 281 S4 Bis, B-9000 Ghent, Belgium
[4] Heidelberg Univ, Inst Organ Chem, D-69120 Heidelberg, Germany
[5] Heidelberg Univ, Ctr Adv Mat, D-69120 Heidelberg, Germany
[6] Karlsruhe Inst Technol KIT, Inst Nanotechnol INT, D-76344 Eggenstein Leopoldshafen, Germany
基金
澳大利亚研究理事会;
关键词
direct laser writing; erasable structures; light-stabilized dynamic materials; microstructures; multi-materials; photoresists; METAMATERIALS;
D O I
10.1002/adfm.202206303
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
To advance the applications of direct laser writing (DLW), adaptability of the printed structure is critical, prompting a shift toward printing structures that are comprised of different materials, and/or can be partially or fully erased on demand. However, most structures that contain these features are often printed by complex processes or require harsh developing techniques. Herein, a unique photoresist for DLW is introduced that is capable of printing 3D microstructures that can be erased by exposure to darkness. Specifically, microstructures based on light-stabilized dynamic materials are fabricated that remain stable when continously irradiated with green light, but degrade once the light source is switched off. The degradation and light stabilization properties of the printed materials are analyzed in-depth by time-lapse scanning electron microscopy. It is demonstrated that these resists can be used to impart responsive behavior onto the printed structure, and -critically- as a temporary locking mechanism to control the release of moving structural features.
引用
收藏
页数:7
相关论文
共 50 条
  • [41] Fluid approach to 3D microstructures
    Thomson, Joanne
    CHEMICAL SOCIETY REVIEWS, 2007, 36 (06) : C44 - C44
  • [42] Fluid approach to 3D microstructures
    Thomson, Joanne
    NEW JOURNAL OF CHEMISTRY, 2007, 31 (06) : C44 - C44
  • [43] Fluid approach to 3D microstructures
    Thomson, Joanne
    PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2007, 9 (23) : C44 - C44
  • [44] 3D Printed Haptics: Creating Pneumatic Haptic Display Based on 3D Printed Airbags
    Feng, Yuan-Ling
    Peiris, Roshan Lalintha
    Fernando, Charith Lasantha
    Minamizawa, Kouta
    HAPTICS: SCIENCE, TECHNOLOGY, AND APPLICATIONS, PT II, 2018, 10894 : 180 - 192
  • [45] 3D Printed Interconnects on Bendable Substrates for 3D Circuits
    Nassar, Habib
    Pullanchiyodan, Abhilash
    Bhattacharjee, Mitradip
    Dahiya, Ravinder
    PROCEEDINGS OF THE 2019 IEEE INTERNATIONAL CONFERENCE ON FLEXIBLE AND PRINTABLE SENSORS AND SYSTEMS (IEEE FLEPS 2019), 2019,
  • [46] White emission in 3D-printed phosphor microstructures
    Winczewski, Jedrzej
    Herrera, Manuel
    Gardeniers, Han
    Susarrey-Arce, Arturo
    CHEMICAL COMMUNICATIONS, 2023, 59 (21) : 3095 - 3098
  • [47] TOWARD GEOMETRIC CONTROL OF LATE-STAGE DIFFUSION PROPERTIES FOR 3D PRINTED BIODEGRADABLE MICROSTRUCTURES
    Freeman, Emmett Z.
    Grosvenor, Eleanor C.
    Rosenthal, Ian B.
    Acevedo, Ruben
    Sochol, Ryan D.
    2021 34TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2021), 2021, : 1036 - 1039
  • [48] 3D Printed Biohybrid Microsystems
    Prinz, Victor Ya.
    Fritzler, Konstantin B.
    ADVANCED MATERIALS TECHNOLOGIES, 2023, 8 (02)
  • [49] The dynamics of a 3D printed microrotor
    Pinhata, Gustavo M.
    Nicoletti, Rodrigo
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2022, 121 (3-4): : 2803 - 2814
  • [50] 3D Printed Capacitive Sensors
    Shemelya, C.
    Cedillos, F.
    Aguilera, E.
    Maestas, E.
    Ramos, J.
    Espalin, D.
    Muse, D.
    Wicker, R.
    MacDonald, E.
    2013 IEEE SENSORS, 2013, : 495 - 498