Front-end electronics and integration of ATLAS pixel modules

被引：10

作者：

Hügging, F ^{[1
]}

机构：

[1] Univ Bonn, Inst Phys, D-53115 Bonn, Germany

来源：

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT | 2005年 / 549卷 / 1-3期

关键词：

ATLAS; silicon detector; pixel; front-end electronics; deep sub-micron; hybridization; bump-bonding;

D O I：

10.1016/j.nima.2005.04.045

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 e(-) within 25 us in the harsh radiation environment of LHC together with the challenge to cope with the huge amount, of data generated by the 80 million channels of the Pixel detector. For the integration of the 50 mu m pitch hybrid pixel detector, reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large-scale production. (c) 2005 Elsevier B.V. All rights reserved.

引用

页码：157 / 164

页数：8

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