Innovating across the AI stack for scale and speed

被引：0
|
作者：
Khalaf, Rania [1 ]
机构：
[1] IBM Res, Armonk, NY 10504 USA
来源：
2021 IEEE INTERNATIONAL PARALLEL AND DISTRIBUTED PROCESSING SYMPOSIUM WORKSHOPS (IPDPSW) | 2021年
关键词：
D O I：
10.1109/IPDPSW52791.2021.00140
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：911 / 911
页数：1
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