Guest Editors Introduction: Robust 3-D Stacked ICs

被引：0
|
作者：
Hopsch, Fabian [1 ]
Marinissen, Erik Jan [2 ]
机构：
[1] Fraunhofer IIS EAS, Dresden, Germany
[2] IMEC, Leuven, Belgium
来源：
IEEE DESIGN & TEST | 2016年 / 33卷 / 03期
关键词：
D O I：
10.1109/MDAT.2016.2542210
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：6 / 7
页数：2
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