An X-ray photoelectron spectroscopy study of ultra-thin oxynitride films

被引：16
|
作者：
Ladas, S. [1 ]
Sygellou, L. [1 ]
Kennou, S. [1 ]
Wolf, M. [2 ]
Roeder, G. [2 ]
Nutsch, A. [2 ]
Rambach, M. [3 ]
Lerch, W. [3 ]
机构：
[1] Univ Patras, Dept Chem Engn, Surface Sci Lab, Rion 26504, Achaia, Greece
[2] Fraunhofer Inst Integrierte Syst & Bauelementetec, D-91058 Erlangen, Germany
[3] Centrotherm Thermal Solut, D-89143 Blaubeuren, Germany
来源：
THIN SOLID FILMS | 2011年 / 520卷 / 02期
关键词：
Silicon oxynitrides; Thin films; XPS; Thickness measurement; Plasma nitridation; BIAS TEMPERATURE INSTABILITY; NITROGEN; SI; OXIDATION;
D O I：
10.1016/j.tsf.2011.04.161
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Oxynitrides prepared by nitridation of 2 to 5 nm SiO2 films on silicon, were studied by X-ray photoelectron spectroscopy at two analyser exit angles. An iterative procedure was applied to obtain simultaneously the average nitrogen content and the thickness of the nitrided layer, mutually dependent via the electron transport properties of the layer matrix. Inelastic mean free paths and elastic corrections thereof were determined in accordance with ISO18118:2004(E), whereas a set of empirical relative sensitivity factors was used. The results reveal a significant increase of the 2 nm film thickness upon nitrogen incorporation of the order of 50 at.%, whereas the 5 nm films retain their thickness upon comparable extent of nitridation. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码：871 / 875
页数：5
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