Formation of a nanohybrid composite between mesostructured cellular silica foam and microporous copper trimesate

被引:22
|
作者
Seo, You-Kyong [1 ,2 ]
Yoon, Ji Woong [1 ]
Lee, U-Hwang [1 ]
Hwang, Young Kyu [1 ]
Jun, Chul-Ho [2 ]
Chang, Jong-San [1 ]
机构
[1] KRICT, Biorefinery Res Ctr, Res Grp Nanocatalyst, Taejon 305600, South Korea
[2] Yonsei Univ, Dept Chem, Ctr Bioact Mol Hybrid, Seoul 120749, South Korea
基金
新加坡国家研究基金会;
关键词
Metal-organic framework; Cu-3(BTC)(2); Mesostructured cellular silica foam (MCF); Nanocomposite; Hydrophobicity; METAL-ORGANIC FRAMEWORKS; CATALYTIC-PROPERTIES; MICROWAVE SYNTHESIS; MESOPOROUS SILICA; ADSORPTION; SEPARATION; SORPTION; SBA-15;
D O I
10.1016/j.micromeso.2011.12.053
中图分类号
O69 [应用化学];
学科分类号
081704 ;
摘要
A metal-organic framework HKUST-1 or Cu-3(BTC)(2) was synthesized in mesopores of a COOH functionalized mesostructured cellular silica foam (MCF(M)-COOH), resulting in a hydrophobic nanocomposite. The Cu-3(BTC)(2) formed in the MCF(M)-COOH has been prepared by a microwave method with sequential incorporation of copper nitrate and 1,3,5-benzenetricarboxylic acid in a water/ethanol mixture containing the MCF(M)-COOH. The nanocomposite was characterized by XRD, BET, FT-IR, TEM and solid state C-13 NMR. The nanocomposite had a higher hydrophobic property than pure Cu-3(BTC)(2) and MCF(M)-COOH as a result of their hybridization. Moreover, the formation of the nanocomposite increased the sorption rate of cyclohexane vapor as compared with those of pure Cu-3(BTC)(2) and MCF(M)-COOH due to the increased hydrophobicity. (C) 2012 Elsevier Inc. All rights reserved.
引用
收藏
页码:75 / 81
页数:7
相关论文
共 44 条
  • [41] Comparison between the Theoretical, Experimental and Numerical Thermal Conductivity of Composite Thermal Interface Materials using Copper Metal Foam
    Kawakita, Shinya
    Teranishi, Minami
    Ishizaka, Yuki
    Fushinobu, Kazuyoshi
    [J]. PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020), 2020, : 654 - 659
  • [42] A STUDY OF INTERFACE REACTION DURING COMPOSITE FORMATION BETWEEN POLYBUTADIENE EPOXIDE AND HIGHLY DISPERSED SILICA OR ALUMINA
    HORTSCHANSKY, P
    HEUBLEIN, G
    [J]. MAKROMOLEKULARE CHEMIE-MACROMOLECULAR CHEMISTRY AND PHYSICS, 1991, 192 (07): : 1535 - 1540
  • [43] Adhesion Characterization and Enhancement between Polyimide-Silica Composite and Nodulated Copper for Applications in Next-Generation Microelectronics
    Doshi, Sagar M.
    Barry, Alexander
    Schneider, Alexander
    Parambil, Nithin
    Mulzer, Catherine
    Yahyazadehfar, Mobin
    Samadi-Dooki, Aref
    Foltz, Benjamin
    Warrington, Keith
    Wessel, Richard
    Zhang, Lei
    Simone, Christopher
    Blackman, Gregory S.
    Lamontia, Mark A.
    Gillespie Jr, John W.
    [J]. ACS APPLIED MATERIALS & INTERFACES, 2024, 16 (02) : 2692 - 2703
  • [44] Electrodeposition of nano-diamond/copper composite platings: Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface
    Hagio, Takeshi
    Park, Jae-Hyeok
    Naruse, Yuto
    Goto, Yasuki
    Kamimoto, Yuki
    Ichino, Ryoichi
    Bessho, Takeshi
    [J]. SURFACE & COATINGS TECHNOLOGY, 2020, 403