We propose an application of spectroscopic ellipsometry pertinent to the characterization of nanostructure inclination of oblique thin films. This technique is employed ex situ in the measurement of silicon thin films fabricated at oblique incidence and modeled as aggregate microstructures formed from amorphous silicon, silicon oxide, and void in the effective medium model. The technique may also be utilized in situ as a powerful probe for the characterization of oblique thin films during their fabrication and processing. (C) 2005 American Institute of Physics.
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USA, Res Lab, Weapons & Mat Res Directorate, Aberdeen Proving Ground, MD 21005 USAUSA, Res Lab, Weapons & Mat Res Directorate, Aberdeen Proving Ground, MD 21005 USA
Cole, MW
Nothwang, WD
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机构:USA, Res Lab, Weapons & Mat Res Directorate, Aberdeen Proving Ground, MD 21005 USA
Nothwang, WD
Demaree, JD
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机构:USA, Res Lab, Weapons & Mat Res Directorate, Aberdeen Proving Ground, MD 21005 USA
Demaree, JD
Hirsch, S
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机构:USA, Res Lab, Weapons & Mat Res Directorate, Aberdeen Proving Ground, MD 21005 USA
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City Univ Hong Kong, Dept Phys & Mat Sci, Kowloon, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Phys & Mat Sci, Kowloon, Hong Kong, Peoples R China
Li, X
Zhai, JW
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City Univ Hong Kong, Dept Phys & Mat Sci, Kowloon, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Phys & Mat Sci, Kowloon, Hong Kong, Peoples R China
Zhai, JW
Chen, HD
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City Univ Hong Kong, Dept Phys & Mat Sci, Kowloon, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Phys & Mat Sci, Kowloon, Hong Kong, Peoples R China