The roles of complexing agents on copper CMP

被引：0
|
作者：
Lim, G [1 ]
Kim, TE [1 ]
Lee, JH [1 ]
Kim, J [1 ]
Lee, HW [1 ]
机构：
[1] Korea Inst Sci & Technol, NMRC, Seoul 136791, South Korea
来源：
THIN FILM MATERIALS, PROCESSES, AND RELIABILITY: PLASMA PROCESSING FOR THE 100 NM NODE AND COPPER INTERCONNECTS WITH LOW-K INTER-LEVEL DIELECTRIC FILMS | 2003年 / 2003卷 / 13期
关键词：
D O I：
暂无
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The effects of different complexing agents, glycine and ethylenediamine, on the stability of CMP slurry for copper and on overall CMP performance were investigated. According to the investigation, glycine did not affect the stability of SiO2 slurry whereas ethylenediamine shifted the iso-electric point of SiO2, making CMP slurry unstable. Electrostatic and actual CMP test were performed under different slurry conditions containing different complexing agents. Corrosion rate and resulting microstructure of reacted surface was strongly dependent on die slurry chemicals. Glycine based system make rather porous surface while ethylenediamine based one make relatively dense surface. H2O2-ethylenediamine system showed similar pH dependency between static corrosion rate and dynamic polishing rate whereas H2O2-glycine system showed totally different tendency.
引用
收藏
页码：266 / 271
页数：6
相关论文
共 50 条
  • [41] Investigation of polyhydroxy polyamino complexing agent on CMP of TSV wafer
    Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China
    Gongneng Cailiao, 2013, 24 (3603-3605+3610):
  • [42] Thermodynamic parameters of reactions of basic copper carbonates formation with participation of organic complexing agents
    Fomin, V. N.
    Rozhkovoy, I. E.
    Gogol, D. B.
    Ponomarev, D. L.
    BULLETIN OF THE UNIVERSITY OF KARAGANDA-CHEMISTRY, 2015, (80): : 22 - 26
  • [43] Experimental and computational investigation of complexing agents on copper dissolution for chemical mechanical polishing process
    Hu, Lianjun
    Pan, Guofeng
    Chen, Qi
    Li, Lipeng
    Ma, Yunpeng
    Zhang, Yong
    COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2023, 664
  • [44] AMINOALKYLPHOSPHINIC ACIDS AS COMPLEXING AGENTS
    PARKER, D
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1991, 201 : 459 - INOR
  • [45] Synergistic roles of mixed inhibitors and the application of mixed complexing ligands in copper chemical mechanical polishing
    Wang Ning
    Pan Guoshun
    Liu Yan
    MICROELECTRONIC ENGINEERING, 2011, 88 (11) : 3372 - 3374
  • [46] EMULSIFIERS AS PROTEIN COMPLEXING AGENTS
    HUGHES, EJ
    JOURNAL OF THE AMERICAN OIL CHEMISTS SOCIETY, 1980, 57 (02) : A132 - A132
  • [47] COMPLEXING AGENTS FROM MICROORGANISMS
    BIRCH, L
    BACHOFEN, R
    EXPERIENTIA, 1990, 46 (08): : 827 - 834
  • [48] Role of slurry in copper CMP
    Brusic, V.
    Wang, S.
    Hawkins, J.
    Cherian, I.
    Knowles, L.
    Schmidt, C.
    Baker, C.
    Garcia, D.
    Miller, K.
    Cruz, B.
    Grover, G.
    Kistler, R.
    Yu, C.
    European Semiconductor, 1999, 21 (04): : 49 - 50
  • [49] Copper CMP: a question of tradeoffs
    Singer, Peter
    Semiconductor International, 2000, 23 (05) : 73 - 74
  • [50] Effect of glycine on copper CMP
    Soocheon Jang
    Haedo Jeong
    Minjong Yuh
    Inho Park
    Jaehong Park
    International Journal of Precision Engineering and Manufacturing-Green Technology, 2016, 3 : 155 - 159
12345