Development of a high-speed manufacturing method for electroplated diamond wire tools

被引:61
|
作者
Chiba, Y
Tani, Y
Enomoto, T
Sato, H
机构
[1] Univ Tokyo, Inst Ind Sci, Tokyo, Japan
[2] Chuo Univ, Tokyo 112, Japan
来源
CIRP ANNALS-MANUFACTURING TECHNOLOGY | 2003年 / 52卷 / 01期
关键词
grinding; wire tool; electroplating;
D O I
10.1016/S0007-8506(07)60584-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Fixed-abrasive multi-wire sawing processes can be used to slice silicon and quartz crystal due to the introduction of resinoid diamond-wire or electroplated diamond-wire tools. The latter kind have a higher wear resistance, but have higher production costs because electroplating is time consuming. Consequently, it is impractical to use them because they are too expensive. In this paper, ultra high-speed electroplating using felt brushes is proposed for manufacturing them. A series of experiments revealed that production speed is improved 30 times and tools produced with the new process have a higher wear resistance than commercially produced tools.
引用
收藏
页码:281 / 284
页数:4
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