Processing of free-space optical interconnect devices using solder engineering.

被引：0

作者：

Dimoulas, A ^{[1
]}

Strifas, N ^{[1
]}

Esser, R ^{[1
]}

Christou, A ^{[1
]}

Stone, RV ^{[1
]}

Travers, CM ^{[1
]}

Guilfoyle, PS ^{[1
]}

Hessenbruch, J ^{[1
]}

机构：

[1] Univ Maryland, Ctr Optoelect Devices Interconnects & Packaging, College Pk, MD 20742 USA

来源：

OPTOELECTRONIC INTERCONNECTS V | 1998年 / 3288卷

关键词：

optical interconnections; packaging; hybrid integration; solder; materials processing;

D O I：

10.1117/12.307581

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A packaging technology for global (N-4) free space optical interconnections has been developed and implemented by means of hybrid integration using solder engineering. Solder arrays, defined by photolithography and electrodeposition, are used to physically attach, optically align and electrically connect the microoptical components. A processing sequence has been fully developed for the fabrication of the emitter sub-assembly consisting of 8x8 and 16x16 arrays of vertical cavity surface emitting lasers and diffractive optical interconnect elements. The first level of integration consisting of the metal signal lines, ground plane and solder arrays has been completed with excellent uniformity and yield of the deposited solder.

引用

页码：262 / 268

页数：7

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