Solder joint characteristics and reliability of lead-free area array packages assembled at various tin-lead soldering process conditions

被引：7

作者：

Nguyen, Jennifer ^{[1
]}

Geiger, David ^{[1
]}

Rooney, Daniel ^{[1
]}

Shangguan, Dongkai ^{[1
]}

机构：

[1] Flextron Int, San Jose, CA 95131 USA

来源：

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 2008年 / 31卷 / 03期

关键词：

backward compatibility; backward compatible assembly; bend test; drop test; lead-free; mechanical shock environment; mixed alloy; reflow temperature; reliability; shear test; SnAgCu alloy; thermal cycle test; thermal shock environment; tin percentage;

D O I：

10.1109/TEPM.2008.926282

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents a comprehensive study on the effects of critical process conditions on solder joint metallurgy and reliability of mixed-alloy solder joints. The solder joint metallurgy of mixed alloys was characterized and the lead distribution through the solder joint was analyzed, for different package types and under various process conditions. The results showed that the solder paste amount (ultimately the tin percentage (Sn%) in the alloy) and the reflow temperature play critical roles in the mixed-alloy assembly, both in terms of compositional homogeneity and voiding. The reliability of mixed-alloy solder joints was then studied at various process conditions, under different thermal and mechanical stress environments. The study revealed that the sensitivity of the reliability of the mixed-alloy solder joints to the process condition depends on the type of environmental loading.

引用

页码：227 / 239

页数：13

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