Environmentally safe plating of tin-lead alloy coatings

被引：0
|
作者：
Kruglikov, SS [1 ]
Turaev, DY [1 ]
Borodulin, AA [1 ]
机构：
[1] Mendeleev Univ Chem Technol, Moscow 125047, Russia
来源：
PROTECTION OF METALS | 2005年 / 41卷 / 06期
关键词：
Waste Water; Experimental Study; Inorganic Chemistry; Electronic Device; Print Circuit Board;
D O I：
10.1007/s11124-005-0085-1
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
The aim of this experimental study was to minimize the input of lead and tin ions and fluoboric acid into the waste water from the electroplating line, where the printed circuit boards and other parts of electronic devices are plated with tin-lead alloy. For this purpose, after unloading the parts from the plating tank, they were rinsed in the reclaim tank, from which the aforementioned ions were removed with a reclaim immersed electrochemical module (IEM).
引用
收藏
页码：589 / 591
页数：3
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