Evaluation on of Half-Bridge Power Module with POL-kW

被引：3

作者：

Hayashibe, Shingo ^{[1
]}

Murayama, Kei ^{[1
]}

Bando, Koji ^{[1
]}

Ito, Hitoshi ^{[1
]}

Suzuki, Hirotsugu ^{[2
]}

Sugita, Takanori ^{[3
]}

机构：

[1] SHINKO ELECT IND CO LTD, Res & Dev Div, Nagano, Japan

[2] Headspring Inc, Technol Grp, Tokyo, Japan

[3] Headspring Inc, Tokyo, Japan

来源：

2021 IEEE CPMT SYMPOSIUM JAPAN (ICSJ) | 2021年

关键词：

Power Overlay; power modules; silicon carbide; gallium nitride;

D O I：

10.1109/ICSJ52620.2021.9648856

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In recent years, SiC & GaN, so-called a wide bandgap (WBG) power devices, have begun to he introduced into the market. More sophisticated packaging technology to maximize the performance of WBG devices are required accordingly. Power-Overlay-kilo-Watt (POL-kW) is an advanced package for high power applications. Physical model scale comparison of power modules between employing the POL-kW and the existing package demonstrated the electrical and thermal advantage of POL-kW. Compared to Half-bridge power module with POL-kW and existing package, the module with POL-kW offered 50% volume reduction, 20% thermal conductivity improvement, and lower turn off surge voltage were realized.

引用

页码：130 / 133

页数：4

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