Manufacturing of 3-D microstructures using novel UPSAMS process for MEMS applications

被引：0

作者：

Sharon, A ^{[1
]}

Bilsing, A ^{[1
]}

Lewis, G ^{[1
]}

Zhang, X ^{[1
]}

机构：

[1] Boston Univ, Dept Mfg Engn, Brookline, MA 02446 USA

来源：

NANO-AND MICROELECTROMECHANICAL SYSTEMS (NEMS AND MEMS) AND MOLECULAR MACHINES | 2003年 / 741卷

关键词：

D O I：

暂无

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

This paper introduces a new microfabrication technique, Ultraprecision Manufacturing of Self-Assembled Micro-Systems (UPSAMS), which combines ultraprecision micromachining (milling/turning/drilling/grinding) with sacrificial/structural multi-layer manufacturing processes to produce self-assembled, 3-D microsystems and associated mesoscale interfaces from a variety of materials for MEMS applications. With this process, a new class of microsystems can be developed that is highly three dimensional, precisely machined, and automatically assembled.

引用

页码：151 / 156

页数：6

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