Manufacturing of 3-D microstructures using novel UPSAMS process for MEMS applications

被引：0
|
作者：
Sharon, A [1 ]
Bilsing, A [1 ]
Lewis, G [1 ]
Zhang, X [1 ]
机构：
[1] Boston Univ, Dept Mfg Engn, Brookline, MA 02446 USA
来源：
NANO-AND MICROELECTROMECHANICAL SYSTEMS (NEMS AND MEMS) AND MOLECULAR MACHINES | 2003年 / 741卷
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D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
This paper introduces a new microfabrication technique, Ultraprecision Manufacturing of Self-Assembled Micro-Systems (UPSAMS), which combines ultraprecision micromachining (milling/turning/drilling/grinding) with sacrificial/structural multi-layer manufacturing processes to produce self-assembled, 3-D microsystems and associated mesoscale interfaces from a variety of materials for MEMS applications. With this process, a new class of microsystems can be developed that is highly three dimensional, precisely machined, and automatically assembled.
引用
收藏
页码：151 / 156
页数：6
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