Active Fluidic Cooling on Energy Constrained System-on-Chip Systems

被引：7

作者：

Yueh, Wen ^{[1
]}

Wan, Zhimin ^{[2
]}

Xiao, He ^{[1
]}

Yalamanchili, Sudhakar ^{[1
]}

Joshi, Yogendra ^{[2
]}

Mukhopadhyay, Saibal ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30313 USA

[2] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30313 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2017年 / 7卷 / 11期

基金：

美国国家科学基金会;

关键词：

Closed-loop control; microfluidic cooling; piezoelectric pump; system-on-chip (SoC);

D O I：

10.1109/TCPMT.2017.2746667

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents design, experimental characterization, and feasibility analysis of integrated in-package fluidic cooling for mobile systems-on-chips (SoCs). A pin fin interposer for fluidic cooling is designed and integrated with a commercial SoC. The demonstrated system integrates an active low-power piezoelectric pump controlled by the SoC itself and a metal/acrylic-based board-scale heat spreader and exchanger. Different software-based policies in the SoC for controlling the fluid flow based on SoC's temperature and performance are implemented and compared. The measurement results demonstrate that the in-package fluidic cooling improves the SoC's energy efficiency and reduces design footprint compared to external passive cooling.

引用

页码：1813 / 1822

页数：10

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