There is more than moore in automotive ...

被引：0
|
作者：
Hiller, Hartmut [1 ]
机构：
[1] Infineon Technol AG, D-81726 Munich, Germany
来源：
2007 44TH ACM/IEEE DESIGN AUTOMATION CONFERENCE, VOLS 1 AND 2 | 2007年
关键词：
automotive; design; manufacturability; ESD; EMC; reliability; substrate modeling;
D O I：
10.1109/DAC.2007.375190
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
The complete "Automotive value chain" is facing significant innovation pressure coming from emerging safety and / or environmental regulations & laws as well as the end customer's demand for more functionality & comfort at not increasing prizes. The presentation will explain the challenging implications of this development for Infineon as an IDM. It will also explain that moving towards leading edge technologies (65nm and beyond) is not our preferred answer to meet "Military quality/reliability requirements at consumer electronics prices". Therefore our requirements towards the EDA industry have to be aligned with Automotive applications and the corresponding business environment.
引用
收藏
页码：376 / 376
页数：1
相关论文
共 50 条
  • [1] More than Moore or More Moore: a SWOT analysis
    Hutcheson, G. Dan
    Bennett, Herbert S.
    [J]. FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2011, 2011, 1395
  • [2] SOTB (Silicon on Thin Buried Oxide): More than Moore technology for IoT and Automotive
    Hasegawa, Takumi
    Yamamoto, Yoshiki
    Makiyama, Hideki
    Shinkawata, Hiroki
    Kamohara, Shiro
    Yamaguchi, Yasuo
    [J]. 2017 IEEE INTERNATIONAL CONFERENCE ON IC DESIGN AND TECHNOLOGY (ICICDT), 2017,
  • [3] More Moore meets More than Moore: Enabling healthcare applications
    Brongersma, Sywert H.
    Blauw, Michiel
    Zevenbergen, Marcel
    Karabacak, Devrez
    Vitushinsky, Roman
    Van Anh Dam
    Calama, Mercedes Crego
    Vullers, Rudolf
    Zeng, Zeng
    van Schaijk, Rob
    [J]. PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 11, NO 1, 2014, 11 (01): : 46 - 49
  • [4] More Moore and More than Moore meeting for 3D
    Deleonibus, S.
    [J]. 2015 30TH SYMPOSIUM ON MICROELECTRONICS TECHNOLOGY AND DEVICES (SBMICRO), 2015,
  • [5] The 'more Moore' and 'more than Moore' in microelectronics technology and IC industry
    Gao, Yuan
    [J]. NATIONAL SCIENCE REVIEW, 2016, 3 (02) : 158 - 158
  • [6] System Integration - The Bridge between More than Moore and More Moore
    Heinig, Andy
    Dietrich, Manfred
    Herkersdorf, Andreas
    Miller, Felix
    Wild, Thomas
    Hahn, Kai
    Gruenewald, Armin
    Brueck, Rainer
    Kroehnert, Steffen
    Reisinger, Jochen
    [J]. 2014 DESIGN, AUTOMATION AND TEST IN EUROPE CONFERENCE AND EXHIBITION (DATE), 2014,
  • [7] Substrate innovation for extending Moore and more than Moore
    Sadaka, Mariam
    Maleville, Christophe
    [J]. SOLID STATE TECHNOLOGY, 2015, 58 (05) : 18 - 25
  • [8] Engineered Substrates for Future More Moore and More Than Moore Integrated Devices
    Clavelier, L.
    Deguet, C.
    Di Cioccio, L.
    Augendre, E.
    Brugere, A.
    Gueguen, P.
    Le Tiec, Y.
    Moriceau, H.
    Rabarot, M.
    Signamarcheix, T.
    Widiez, J.
    Faynot, O.
    Andrieu, F.
    Weber, O.
    Le Royer, C.
    Batude, P.
    Hutin, L.
    Damlencourt, J-F.
    Deleonibus, S.
    Defay, E.
    [J]. 2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGEST, 2010,
  • [9] The rationale and paradigm of "More than Moore"
    Zhang, G. Q.
    Graef, Mart
    van Roosmalen, Fred
    [J]. 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 151 - +
  • [10] Roadmap challenges - There is more than Moore
    van Roosmalen, AJ
    [J]. THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, 2004, : 3 - 3
12345