A flexible 'wrapper' enables secure IP sharing

被引:0
|
作者
Ramus, B [1 ]
机构
[1] ILS Technol, Boca Raton, FL USA
关键词
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暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The growing need for collaboration in the semiconductor industry has created an additional challenge: protection of intellectual property (113) while sharing capabilities in wafer fabs. Concern over IP protection in today's partnerships has inhibited improvements in overall factory effectiveness. To address this problem, a new approach to IP protection has been developed using distributed object-based software that associates security with data content rather than data transmission or storage. The net effect is the ability to integrate security directly into software and manufacturing tools - opening up access, when needed, while protecting IP.
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页码:55 / +
页数:3
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