Synthesis, Characterization and Material Application of Poly(ester-oxysilane-imide)s Having Epoxy Residues

Poly(ester-oxysilane-imide)s (IIIa-d) were prepared by the intermolecular Diels-Alder (DA) reaction of epoxy residue based bismaleimides (IIa-d) with bis(furan-2-ylmethoxy) dimethyl silane (Bisfuran) (I). The DA reaction was carried out in tetrahydrofuran as a solvent, as well as in bulk, followed by aromatization of DA polyadduct intermediates in the presence of acetic anhydride. All the resultant polymers designed as Poly(ester-oxysilane-imide)s (PEOSIs) were characterized by elemental analysis, IR spectral studies, number average molecular weight ((Mn) over bar) estimated by Vapor pressure osmometer (VPO) and thermogravimetry. The PEOSIs exhibit good thermal stability. Bismaleimides (IIa-d) and bisfuran (I) were polymerized (at 140 +/- 10 degrees C) by 'in situ' DA intermolecular reaction into moderately thermally stable PEOSIs glass and carbon fiber reinforced composites (GFRC and CFRC) and were characterized by their chemical resistance, mechanical properties and electrical properties.