Fabrication and characterization of nickel-gold plateble LTCC substrates based on borosilicate glass/Al2O3 system

被引:0
|
作者
Wan Huanhuan [1 ]
Zhang Weijun [1 ]
Liu Zhuofeng [1 ]
机构
[1] Natl Univ Def Technol, Coll Aerosp Sci & Engn, Changsha, Hunan, Peoples R China
关键词
substrate; densification; corrosion; metallization; electroless-plating;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Borosilicate glass with the additions of Al2O3 (40 similar to 55%) composites were sintered at 850 degrees C. Different qualitative and quantitative instruments were used to employ the influence mechanism of the different Al2O3 contents on the properties of the composites.Composites with 45wt% Al2O3 sintered at 850 degrees C presented great performance: the bulk density of 2.51 g/cm(3) , the dielectric constant of 5.27 and the dielectric loss of 0.0027 at 1 MHz, the thermal expansion coefficient of 5.79*10(-6) ppm/degrees C,the flexural strength of 142.5MPa and the weight loss of 2.78 mg/cm(2) after soaking in 1 mol/L nitric acid Solution. The composite could meet the shrinkage requirement of Ag electrodes and could not possibly react with Ag electrodes any more. The metallized substrate can withstand the electroless nickel immersion gold process.
引用
收藏
页码:1649 / 1652
页数:4
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