Effect of strain rate and temperature on the tensile properties of tin-based lead-free solder alloys

被引:21
|
作者
Bai, Ning [1 ]
Chen, Xu [1 ]
Fang, Zhou [1 ]
机构
[1] Tianjin Univ, Sch Chem Engn & Technol, Tianjin 300072, Peoples R China
关键词
lead-free solders; tensile properties; strain rate sensitivity; activation energy; elongation;
D O I
10.1007/s11664-008-0445-0
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The tensile properties of Sn-3Ag-0.5Cu, Sn-3.5Ag, and Sn-0.7Cu lead-free solders were investigated on small-scale specimens and compared with those of Sn-37Pb eutectic solder at various strain rates from 1 x 10(-4) s(-1) to 1 x 10(-2) s(-1) and over a wide temperature range from 25 degrees C to 150 degrees C. The tests were under true strain-rate-controlled conditions. The ductility of each lead-free solder is relatively constant while that for Sn-Pb eutectic solder strongly depends on strain rate and temperature. The strain rate sensitivity index m for lead-free solders is relatively stable and showed little dependence on temperature, whereas the values of m for Sn-37Pb increased linearly with increasing temperature.
引用
收藏
页码:1012 / 1019
页数:8
相关论文
共 50 条
  • [31] Reliability of lead-free solder alloys
    Igoshev, V
    Kleiman, J
    ENVIRONMENT CONSCIOUS MATERIALS - ECOMATERIALS, 2000, : 703 - 715
  • [32] Electrodeposition of lead-free solder alloys
    Goh, Yingxin
    Haseeb, A. S. M. A.
    Sabri, Mohd Faizul Mohd
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2013, 25 (02) : 76 - 90
  • [33] Effect of rapid solidification on structure and properties of some lead-free solder alloys
    Kamal, Mustafa
    Gouda, El-Said
    MATERIALS AND MANUFACTURING PROCESSES, 2006, 21 (08) : 736 - 740
  • [34] The status of lead-free solder alloys
    Seelig, K
    Suraski, D
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1405 - 1409
  • [35] Creep properties of Sn-Sb based lead-free solder alloys
    El-Daly, A. A.
    Swilem, Y.
    Hammad, A. E.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 471 (1-2) : 98 - 104
  • [36] Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints
    Jian Lin
    Yongping Lei
    Hanguang Fu
    Fu Guo
    Journal of Electronic Materials, 2018, 47 : 2073 - 2081
  • [37] Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints
    Lin, Jian
    Lei, Yongping
    Fu, Hanguang
    Guo, Fu
    JOURNAL OF ELECTRONIC MATERIALS, 2018, 47 (03) : 2073 - 2081
  • [38] Effects of temperature and strain rate on the mechanical properties of lead-free solders
    Ma, Hongtao
    JOURNAL OF MATERIALS SCIENCE, 2010, 45 (09) : 2351 - 2358
  • [39] Effects of temperature and strain rate on the mechanical properties of lead-free solders
    Hongtao Ma
    Journal of Materials Science, 2010, 45 : 2351 - 2358
  • [40] Deformation mechanisms in tin and tin-based electronic solder alloys
    Mathew, MD
    Movva, S
    Murty, KL
    CREEP AND FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES, 2000, 171-1 : 655 - 662