共 50 条
- [4] BACKPANELS - KEY TO PACKAGING HIGH-DENSITY CIRCUITS ELECTRONIC PRODUCTS MAGAZINE, 1976, 19 (03): : 21 - 27
- [6] ELECTRON-BEAM FABRICATION OF HIGH-DENSITY CIRCUITS BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1976, 21 (11): : 1339 - 1339
- [7] HIGH-DENSITY MULTIWIRE CIRCUITS USING THINNER WIRES IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (02): : 224 - 229
- [8] PECVD of transition metals for the production of high-density circuits SURFACE & COATINGS TECHNOLOGY, 1999, 116 : 886 - 890