A Novel 3D Stacking Method for Opto-Electronic Dies on CMOS ICs

被引：0
|
作者：
Duan, P. [1 ]
Raz, O. [1 ]
Smalbrugge, B. E. [1 ]
Duis, J.
Dorren, H. J. S. [1 ]
机构：
[1] Eindhoven Univ Technol, COBRA Res Sch, NL-5600 MB Eindhoven, Netherlands
来源：
2012 38TH EUROPEAN CONFERENCE AND EXHIBITION ON OPTICAL COMMUNICATIONS (ECOC) | 2012年
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
High speed, high density and low cost solution for realizing optical interconnects is presented. An opto-electronic die, directly bonded on top of CMOS IC driver, is connected using metal traces lithographically defined. A twelve channel transmitter based on the technique was fabricated, and test shows good performance up to 12.5 Gb/s/ch.
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页数：3
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