Processing of amorphous silicon flat panel displays with large-area excimer lasers

Historical background and present status of excimer laser annealing of amorphous silicon for poly-TFTs fabrication are presented. Scanning and single shot systems are compared both on the physical and economical aspects. Process optimisation and process control using real time spectroscopic ellipsometry are also presented. Finally, some perspectives in the development of very high power excimer laser are also given.