Optimization of power delivery design and methodologies

被引：0
|
作者：
Tau, Yee Hung See [1 ]
机构：
[1] Intel Penang Design Ctr, George Town 11900, Malaysia
来源：
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3 | 2006年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This paper covers the latest development of next generation I/O interface 3D power delivery modeling methodology to meet the challenging requirements of I/O interfaces. A method for I/O interface power delivery analysis covering package and system level has been developed by combining 3D field solver and Spice simulation. This paper focuses on how designing an optimized and economical power delivery system in order to suppress the high frequency noise effectively with the right tool.
引用
收藏
页码：418 / 420
页数：3
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