Hot embossing of plastic microfluidic devices using poly(dimethylsiloxane) molds

被引：84
|
作者：
Goral, Vasiliy N. [1 ]
Hsieh, Yi-Cheng
Petzold, Odessa N. [1 ]
Faris, Ronald A. [1 ]
Yuen, Po Ki [1 ]
机构：
[1] Corning Inc, Sci & Technol, Corning, NY 14831 USA
来源：
JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2011年 / 21卷 / 01期
关键词：
D O I：
10.1088/0960-1317/21/1/017002
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We present a poly(dimethylsiloxane) (PDMS)-based hot embossing process for low-cost rapid prototyping of plastic microfluidic devices. Unlike the conventional hot embossing process, the process presented here uses a 2 mm thick PDMS mold, two 3/4 '' wide binder clips, two standard 1 mm thick 1 '' x 3 '' microscope glass slides and a standard laboratory oven. Micro-scale features were successfully replicated in 1.5 mm thick polystyrene slides from various PDMS molds. Also, the PDMS molds can be reused for many replications without any damage.
引用
收藏
页数：8
相关论文
共 50 条
  • [41] Separation of proteins on surface-modified poly(dimethylsiloxane) microfluidic devices
    Dou, YH
    Bao, N
    Xu, JJ
    Meng, F
    Chen, HY
    ELECTROPHORESIS, 2004, 25 (17) : 3024 - 3031
  • [42] Method of mould alignment for double-sided hot embossing of microfluidic devices using kinematic constraints
    Conner, Timothy
    Song, In-Hyouk
    Park, Taehyun
    You, Byoung Hee
    MICRO & NANO LETTERS, 2014, 9 (10): : 741 - 745
  • [43] Parameters of hot embossing in Microfluidic Chips
    Wang Wei
    Li Shaofeng
    Tian Li
    Li Jianmin
    Qin Tian
    Liu Xiaowei
    6TH INTERNATIONAL SYMPOSIUM ON PRECISION ENGINEERING MEASUREMENTS AND INSTRUMENTATION, 2010, 7544
  • [44] Hot roller embossing of multi-dimensional microstructures using elastomeric molds
    Z. W. Zhong
    H. H. Ng
    S. H. Chen
    X. C. Shan
    Microsystem Technologies, 2018, 24 : 1443 - 1452
  • [45] Hot roller embossing of multi-dimensional microstructures using elastomeric molds
    Zhong, Z. W.
    Ng, H. H.
    Chen, S. H.
    Shan, X. C.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (03): : 1443 - 1452
  • [46] ON MODELING THE MECHANICAL BEHAVIOR OF AMORPHOUS POLYMERS FOR THE MICRO-HOT-EMBOSSING OF MICROFLUIDIC DEVICES
    Srivastava, Vikas
    Anand, Lallit
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 13, PTS A AND B, 2009, : 113 - 120
  • [47] Surface engineering of poly(dimethylsiloxane) microfluidic devices using transition metal sol-gel chemistry
    Roman, GT
    Culbertson, CT
    LANGMUIR, 2006, 22 (09) : 4445 - 4451
  • [48] Surface molecular property modifications for poly(dimethylsiloxane) (PDMS) based microfluidic devices
    Ieong Wong
    Chih-Ming Ho
    Microfluidics and Nanofluidics, 2009, 7 : 291 - 306
  • [49] A polymeric master replication technology for mass fabrication of poly(dimethylsiloxane) microfluidic devices
    Li, HF
    Lin, JM
    Su, RG
    Cai, ZW
    Uchiyama, K
    ELECTROPHORESIS, 2005, 26 (09) : 1825 - 1833
  • [50] Fabrication of epoxy stamps for hot embossing microfluidic devices and sub-micron structures
    Brown, L
    Koerner, T
    Oleschuk, R
    Micro Total Analysis Systems 2004, Vol 2, 2005, (297): : 52 - 54
12345