Hot embossing of plastic microfluidic devices using poly(dimethylsiloxane) molds

被引：84

作者：

Goral, Vasiliy N. ^{[1
]}

Hsieh, Yi-Cheng

Petzold, Odessa N. ^{[1
]}

Faris, Ronald A. ^{[1
]}

Yuen, Po Ki ^{[1
]}

机构：

[1] Corning Inc, Sci & Technol, Corning, NY 14831 USA

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2011年 / 21卷 / 01期

关键词：

D O I：

10.1088/0960-1317/21/1/017002

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present a poly(dimethylsiloxane) (PDMS)-based hot embossing process for low-cost rapid prototyping of plastic microfluidic devices. Unlike the conventional hot embossing process, the process presented here uses a 2 mm thick PDMS mold, two 3/4 '' wide binder clips, two standard 1 mm thick 1 '' x 3 '' microscope glass slides and a standard laboratory oven. Micro-scale features were successfully replicated in 1.5 mm thick polystyrene slides from various PDMS molds. Also, the PDMS molds can be reused for many replications without any damage.

引用

页数：8

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