Comprehensive system-level optimization of thermoelectric devices for electronic cooling applications

被引：54
|
作者：
Taylor, Robert A. [1 ]
Solbrekken, Gary L. [2 ]
机构：
[1] Arizona State Univ, Dept Mech & Aerosp Engn, Tempe, AZ 85287 USA
[2] Univ Missouri, Dept Mech & Aerosp Engn, Columbia, MO 65211 USA
来源：
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2008年 / 31卷 / 01期
关键词：
electronic cooling; system optimization; thermoelectric (TE);
D O I：
10.1109/TCAPT.2007.906333
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Advanced cooling solutions are needed to address the growing challenges posed by future generations of microprocessors. This paper outlines an optimization methodology for electronic system based thermoelectric (TE) cooling. This study stresses that an optimum TE cooling system should keep the electronic device below a critical junction temperature while utilizing the smallest possible heat sink. The methodology considers the electric current and TE geometry that will minimize the junction temperature. A comparison is made between the junction temperature minimization scheme and the more conventional coefficient of performance (COP) maximization scheme. It is found that it is possible to design a TE solution that will both maximize the COP and minimize the junction temperature. Experimental measurements that validate the modeling are also presented.
引用
收藏
页码：23 / 31
页数：9
相关论文
共 50 条
  • [31] Designing thermoelectric self-cooling system for electronic devices: Experimental investigation and model validation
    Liu, H. R.
    Li, B. J.
    Hua, L. J.
    Wang, R. Z.
    ENERGY, 2022, 243
  • [32] Key Technology of Relay Protection System-level Testing Considering Comprehensive Optimization of Substation Secondary System
    Meng J.
    Li Z.
    Zhan R.
    Mou L.
    Zhou Z.
    Xu K.
    Yu Y.
    Ren Y.
    Dianwang Jishu/Power System Technology, 2023, 47 (09): : 3791 - 3798
  • [33] Optimization of bulk thermoelectric modules for chip cooling applications
    Fukutani, Kazuhiko
    Shakouri, Ali
    ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, : 2175 - 2179
  • [34] System-level Pareto frontiers for on-chip thermoelectric coolers
    Yuruker, Sevket U.
    Fish, Michael C.
    Yang, Zhi
    Baldasaro, Nicholas
    Barletta, Philip
    Barcohen, Avram
    Yang, Bao
    FRONTIERS IN ENERGY, 2018, 12 (01) : 109 - 120
  • [35] System-level Pareto frontiers for on-chip thermoelectric coolers
    Sevket U. Yuruker
    Michael C. Fish
    Zhi Yang
    Nicholas Baldasaro
    Philip Barletta
    Avram Barcohen
    Bao Yang
    Frontiers in Energy, 2018, 12 : 109 - 120
  • [36] Thermal devices integrated with thermoelectric modules with applications to CPU cooling
    Sauciuc, Ioan
    Erturk, Hakan
    Chrysler, Gregory
    Bala, Vikram
    Mahajan, Ravi
    ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, : 2153 - 2159
  • [37] A Comprehensive System-Level Simulation Paradigm for UWB Systems
    Wang, Yazhou
    Kuhn, Michael J.
    Mahfouz, Mohamed R.
    Fathy, Aly E.
    2010 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM, 2010,
  • [38] A COMPUTER CONTROL-SYSTEM FOR THERMOELECTRIC COOLING DEVICES
    WHARTON, DA
    MCCORMICK, B
    CRYO-LETTERS, 1993, 14 (06) : 355 - 360
  • [39] Thermoelectric Self-cooling System of Optical Devices
    Liu, Hao-Ran
    Li, Bang-Jun
    Wang, Ru-Zhu
    Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics, 2022, 43 (03): : 811 - 816
  • [40] System-Level Optimization of Passive Energy Balancing
    Shaw, Alexander D.
    Zhang, Jiaying
    Wang, Chen
    Woods, Benjamin K. S.
    Friswell, Michael I.
    AIAA JOURNAL, 2022, 60 (09) : 5570 - 5580
12345