共 50 条
- [41] Applying TRIZ for Optimization Formulation of Sapphire Precision Lapping DIGITAL DESIGN AND MANUFACTURING TECHNOLOGY, PTS 1 AND 2, 2010, 102-104 : 564 - +
- [42] Uniformity of Kinematic Trajectory with Wafer Driving Initiatively in plane Lapping Process DIGITAL DESIGN AND MANUFACTURING TECHNOLOGY, PTS 1 AND 2, 2010, 102-104 : 555 - 558
- [44] ROLE OF FRICTIONAL FORCES IN GRINDING AND POLISHING PROCESSES IN MACHINES THAT OPERATE BY THE LAPPING METHOD SOVIET JOURNAL OF OPTICAL TECHNOLOGY, 1992, 59 (04): : 250 - 254
- [45] QUALITATIVE ANALYSIS OF ABRASIVE GRAIN WEAR BY ULTRASONIC AIDED PLANE LAPPING MODTECH 2012: NEW FACE OF T M C R, VOLS I AND II, 2012, : 993 - 996
- [46] Uniformity of kinematic trajectory with wafer driving initiatively in plane lapping process Nongye Jixie Xuebao/Transactions of the Chinese Society of Agricultural Machinery, 2010, 41 (04): : 209 - 212+221
- [48] Development of Ultra-precison Single-plane Lapping Machine ADVANCES IN MACHINING AND MANUFACTURING TECHNOLOGY XII, 2014, 589-590 : 491 - 496
- [49] The optimization of lapping process parameters based on extension theory MATERIALS SCIENCE AND NANOTECHNOLOGY I, 2013, 531-532 : 262 - 265
- [50] Computer-Aided Machine Setting for Lapping Optimization JOURNAL OF MECHANICAL DESIGN, 2009, 131 (03) : 0310031 - 0310038