Random vibration analysis of BGA with different size of the SAC0307 solder joint

被引：0
|
作者：
Shen, Linlin [1 ]
Chen, Cong [1 ]
Niu, Xiaoyan [1 ]
机构：
[1] Hebei Univ, Coll Civil Engn & Architecture, Baoding, Peoples R China
来源：
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2018年
基金：
中国国家自然科学基金;
关键词：
BGA; random vibration; the solder joint ize; mechanical properties; IMPACT;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the paper, the mechanical properties of BAG package structure under random vibration load are studied based on the finite element analysis software. And the influence of the height and radius of the solder joint on the mechanical properties of BGA package structure is analyzed through the stress nephogram of the solder joint array and BGA packaging structure. The results show : the solder joint array has greater stress than other parts when BGA package structure is subjected to random vibration load And the stress at the corners of the solder joint array is the greatest. In other words, the cracks produced gradually expand inward from the solder joint outer point on the one side of the test plate. And it eventually lead to the solder joint failure When BGA package structure is subjected to random vibration load the maximum stress of the solder joint decreases with the increase of radius when other conditions are the same. The maximum stress of the solder joint increases with the increase of height when other conditions are the same.
引用
收藏
页码：1019 / 1021
页数：3
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