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- [36] An Analyzing on Material Removal Mechanism in Chemical Mechanical Polishing of Cu ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XV, 2009, 416 : 354 - +
- [38] Effects of grain size and abrasive size of polycrystalline nano-particle ceria slurry on shallow trench isolation chemical mechanical polishing Japanese Journal of Applied Physics, Part 2: Letters, 2004, 43 (3 A):
- [39] Theoretical Simulation and Regression Analysis for Abrasive Removal Depth of Chemical Mechanical Polishing with Pattern-free Polishing Pad at Different Volume Concentrations of Slurry and Experiment JOURNAL OF THE CHINESE SOCIETY OF MECHANICAL ENGINEERS, 2020, 41 (06): : 713 - 723
- [40] Effects of grain size and abrasive size of polyerystalline nano-particle ceria slurry on shallow trench isolation chemical mechanical polishing JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2004, 43 (3A): : L365 - L368